Nvidia directs memory makers to build custom HBM base dies on TSMC's 3nm process
Nvidia has reportedly asked Samsung, SK Hynix, and Micron to manufacture base dies for custom high-bandwidth memory using TSMC's 3nm process, with Samsung agreeing in its first collaboration with the rival foundry.
Nvidia has requested that memory suppliers Samsung Electronics, SK Hynix, and Micron manufacture the base dies for its custom NVHBM memory chips using Taiwan Semiconductor Manufacturing Co.'s 3-nanometer node, according to a Reuters report by Kyu-Seok Shim shared via Techmeme. Samsung agreed to the arrangement, marking the company's first known use of TSMC foundry services.[2][3][4]
Mandating TSMC's 3nm technology across suppliers positions the Taiwanese foundry to profit regardless of which memory vendor secures the final packaging contracts. The shared fabrication base also affords Nvidia greater operational flexibility to reallocate orders across suppliers as high-bandwidth memory pricing fluctuates, while centralizing advanced logic manufacturing to tighten its control over memory performance across artificial intelligence hardware supply chains.[1][5]
Key facts
- Nvidia asked Samsung, SK Hynix, and Micron to build base dies for custom NVHBM memory using TSMC's 3nm process, according to Reuters.
- Samsung agreed to Nvidia's request, marking Samsung's first time using TSMC for fabrication.
- Requiring a unified TSMC 3nm base die allows Nvidia to switch orders between memory makers as HBM prices increase.
- TSMC stands to benefit from the production mandate regardless of which memory manufacturer wins Nvidia's business.
- Centralizing advanced logic manufacturing at TSMC could alter AI hardware supply chains and boost Nvidia's control over memory performance.
Sources · 5 sources
- CB
Crypto BriefingArticle ·
TSMC to build base dies for Nvidia’s custom HBM chips The collaboration centralizes advanced logic production, potentially reshaping AI hardware supply chains and enhancing Nvidia's control over memory performance. The post TSMC to build base dies for Nvidia’s custom HBM chips appeared first on Crypto Briefing .
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Techmeme@TechmemePost on X ·
Sources: Nvidia asked Samsung, SK Hynix, and Micron to make base dies for its custom NVHBM memory on TSMC's 3nm process; Samsung agreed, its first use of TSMC (Kyu-Seok Shim / Reuters) (Visit Techmeme dot com for the link and full context!)
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Polymarket@PolymarketPost on X ·
JUST IN: Samsung & TSMC are reportedly teaming up to produce Nvidia's next-generation high-bandwidth memory chips,
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TechmemeArticle ·
Sources: Nvidia asked Samsung, SK Hynix, and Micron to make base dies for its custom NVHBM memory on TSMC's 3nm process; Samsung agreed, its first use of TSMC (Kyu-Seok Shim/Reuters) Kyu-Seok Shim / Reuters : Sources: Nvidia asked Samsung, SK Hynix, and Micron to make base dies for its custom NVHBM memory on TSMC's 3nm process; Samsung agreed, its first use of TSMC — Samsung Electronics (005930.KS) will use TSMC's (2330.TW) 3-nanometre process to produce base dies for Nvidia's (NVDA.O) …
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Shay Boloor@StockSavvyShayPost on X ·
$NVDA is reportedly requiring Samsung, $MU and $SKHY to build the base die for its next-generation custom HBM on $TSM 3nm process. That gives Nvidia more flexibility to shift orders between suppliers as HBM prices rise while putting TSMC in a position to benefit regardless of which memory maker wins the business.
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